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TMP007 sbos685c ? april 2014 ? revised july 2015 TMP007 infrared thermopile sensor with integrated math engine 1 features 3 description the TMP007 is a fully-integrated microelectro- 1 ? integrated mems thermopile for noncontact mechanical system (mems) thermopile sensor that temperature sensing measures the temperature of an object without direct ? 14-bit local temperature sensor for cold contact. the thermopile absorbs passive infrared junction reference energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view. ? 1 c (max) from 0 c to +60 c ? 1.5 c (max) from ? 40 c to +125 c the internal math engine combines the corresponding change in voltage across the ? integrated math engine thermopile with the internal cold-junction reference ? directly read object temperature temperature sensor to calculate the target object ? programmable alerts temperature. the TMP007 also provides nonvolatile memory for storing calibration coefficients. ? nonvolatile memory for storing calibration coefficients the TMP007 is designed with portability and power in ? transient correction mind, and can easily be placed in the tightest of spaces while using standard surface-mount assembly ? two-wire serial interface options processes. low power consumption also makes it ? i 2 c and smbus compatible well suited for battery-powered applications. ? eight programmable addresses the tmp006 offers a reduced feature set. the ? low power tmp006 offers similar performance as the TMP007, ? supply: 2.5 v to 5.5 v but does not contain the math engine or nonvolatile memory. ? active current: 270 a (typ) ? 2- a shutdown (max) the infrared thermopile sensor is specified to operate from ? 40 c to +125 c. it is possible to measure ? compact package object temperature beyond the device operating ? 1.9-mm 1.9-mm 0.625-mm dsbga range as long as the device itself does not exceed the operating temperature range ( ? 40 c to +125 c). 2 applications device information (1) ? noncontact temperature sensing part number package body size (nom) ? case temperature TMP007 dsbga (8) 1.90 mm 1.90 mm ? laser printers (1) for all available packages, see the package option addendum ? power relays at the end of the datasheet. ? health and beauty ? hvac comfort optimization ? gas concentration ? flame detection functional block diagram 1 an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. v+ agnd dgnd 16-bit adc gain local temperature ir thermopile sensor voltage reference digital control and math engine i 2 c and smbus compatible digital interface alert adr0 adr1 scl sda TMP007 eeprom t hot t cold t hot t hot t hot + productfolder sample &buy technical documents tools & software support &community
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com table of contents 7.5 register maps ........................................................ 26 1 features .................................................................. 1 8 application and implementation ........................ 36 2 applications ........................................................... 1 8.1 application information ............................................ 36 3 description ............................................................. 1 8.2 typical applications ................................................ 36 4 revision history ..................................................... 2 8.3 system examples ................................................... 43 5 pin configuration and functions ......................... 4 9 power-supply recommendations ...................... 44 6 specifications ......................................................... 5 10 layout ................................................................... 45 6.1 absolute maximum ratings ...................................... 5 10.1 layout guidelines ................................................. 45 6.2 esd ratings .............................................................. 5 10.2 layout examples ................................................... 46 6.3 recommended operating conditions ....................... 5 11 device and documentation support ................. 48 6.4 thermal information ................................................. 5 11.1 device support .................................................... 48 6.5 electrical characteristics ........................................... 6 11.2 documentation support ........................................ 48 6.6 typical characteristics .............................................. 7 11.3 community resources .......................................... 48 7 detailed description ............................................ 10 11.4 trademarks ........................................................... 48 7.1 overview ................................................................. 10 11.5 electrostatic discharge caution ............................ 48 7.2 functional block diagram ....................................... 10 11.6 glossary ................................................................ 48 7.3 feature description ................................................. 10 12 mechanical, packaging, and orderable 7.4 device functional modes ........................................ 23 information ........................................................... 49 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision b (may 2014) to revision c page ? changed features , applications , and description sections ................................................................................................... 1 ? changed thermopile sensor portion of functional block diagram ........................................................................................... 1 ? changed handling ratings to esd ratings and moved storage temperature to absolute maximum ratings ..................... 5 ? added " full angle " to clarify field of view parameter in electrical characteristics ................................................................... 6 ? changed figure 2 ................................................................................................................................................................... 7 ? changed thermopile sensor portion of functional block diagram ......................................................................................... 10 ? deleted last sentence from 2nd paragraph of field of view and angular response section .............................................. 12 ? added figure 20 .................................................................................................................................................................. 12 ? changed text in thermopile principles and operation section to clarify temperature measurement ................................. 13 ? changed value in stefan-boltzman constant definition from 5.7 to 5.67 in equation 5 ...................................................... 14 ? changed c to c2 in table 1 ................................................................................................................................................. 14 ? changed recalibration item 3 in calibration section ............................................................................................................. 15 ? changed recalibration item 8 in calibration section ............................................................................................................. 15 ? added sensor voltage format section ................................................................................................................................. 16 ? added temperature format section ..................................................................................................................................... 17 ? changed text in temperature format section to clarify temperature conversion to degrees celsius ................................. 17 ? changed text in slave receiver mode section ..................................................................................................................... 19 ? changed text in slave transmitter mode section ................................................................................................................. 19 ? changed figure 24 to clarify timing ...................................................................................................................................... 21 ? changed incorrect sda timing in figure 25 ......................................................................................................................... 22 ? changed sda timing in figure 26 ....................................................................................................................................... 22 ? changed register names in table 7 to match registers in the rest of document. ............................................................... 26 ? changed register 2 reset value ............................................................................................................................................ 26 ? changed c coefficient to c2 coefficient in table 7 .............................................................................................................. 26 ? added manufacturer id register ........................................................................................................................................... 26 2 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 revision history (continued) ? added missing numbers (3, 2, and 1) to bit descriptions for a1, a2, b0, b1, and b2. ........................................................ 27 ? changed register names in table 8 to match register names in rest of document ............................................................. 27 ? changed c coefficient to c2 coefficient in table 8 .............................................................................................................. 27 ? changed figure 31 bit register to show correct bit names ................................................................................................... 28 ? changed figure 32 bit register reset values ........................................................................................................................ 28 ? added t obj to all object temperature titles in data sheet .................................................................................................. 29 ? changed figure 36 to figure 39 bit register descriptions to show correct bit names .......................................................... 31 ? changed figure 40 bit register reset values ........................................................................................................................ 32 ? deleted " twos complement format " from s0 bit description ............................................................................................... 32 ? changed figure 41 bit register reset values ........................................................................................................................ 32 ? changed figure 42 bit register reset values ........................................................................................................................ 32 ? changed c to c2 in c2 coefficient register section ........................................................................................................... 33 ? added manufacturer id register ........................................................................................................................................... 34 ? changed figure 50 bit register names and reset values ..................................................................................................... 34 ? changed bit names in figure 51 to match the text shown in table 8 .................................................................................. 35 ? changed bit names in figure 52 to match the text shown in table 8 .................................................................................. 35 ? changed capacitor in figure 53 from 0.01 f to 0.1 f ...................................................................................................... 36 ? changed capacitor in figure 56 from 0.01 f to 0.1 f ...................................................................................................... 40 ? changed b to in equation 20 to show correct stefan-boltzmann symbol ...................................................................... 43 ? changed symbol for stefan-boltzmann constant from b to in equation 20 ..................................................................... 43 ? changed decoupling capacitor in power-supply recommendations section from 0.01 f to 0.1 f ................................. 44 ? changed title for figure 61 .................................................................................................................................................. 46 ? deleted figure 63, bottom layer ........................................................................................................................................ 47 changes from revision a (may 2014) to revision b page ? changed absolute maximum ratings operating temperature range parameter min value from ? 40 to ? 55 ......................... 5 ? added operating temperature range parameter to recommended operating conditions .................................................... 5 ? changed the por registers in figure 32 ............................................................................................................................ 28 ? added olf bit to status register, figure 34 ........................................................................................................................ 29 ? changed ohf bit to status register, figure 34 ................................................................................................................... 29 ? changed table 9 .................................................................................................................................................................. 32 ? changed the por registers in figure 40 through figure 48 ................................................................................................ 32 ? changed the por registers in figure 50 and figure 52 ...................................................................................................... 34 ? changed table 14 header row titles .................................................................................................................................... 40 ? changed table 14 header row titles .................................................................................................................................... 41 ? changed figure 61 .............................................................................................................................................................. 46 ? changed figure 63, bottom layer ....................................................................................................................................... 47 ? changed figure 62 ............................................................................................................................................................... 47 changes from original (may 2014) to revision a page ? changed from product preview to production data ............................................................................................................... 1 copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 3 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 5 pin configuration and functions yzf package 8-pin dsbga top view pin functions pin name no. description adr0 c1 input address 0 selection pin adr1 b1 input address 1 selection pin agnd a2 analog ground alert c2 alert output pin; active low, open-drain. requires a pull-up resistor to (1.6 v to 5.5 v) supply dgnd a1 digital ground scl b3 input clock pin sda c3 input/output data pin; open-drain; requires pull-up resistor to (1.6 v to 5.5 v) supply v+ a3 supply voltage (2.5 v to 5.5 v) 4 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 c1 c3 c2 b1 b3 a1 a3 a2 sensor c b a 1 3 2 rows columns
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 6 specifications 6.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) (1) (2) min max unit supply voltage, v s 7 v voltage adr1 v s + 0.5 v input voltage all other pins ? 0.5 +7 v current input current, any pin 10 ma operating range ? 40 +125 c temperature junction, t j 125 c storage, t stg ? 65 +125 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) input voltage rating applies to all TMP007 input voltages. 6.2 esd ratings value unit human-body model (hbm), per ansi/esda/jedec js-001 (1) 2000 electrostatic v (esd) charged-device model (cdm), per jedec specification jesd22-c101 (2) 500 v discharge machine model 200 (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min nom max unit supply voltage, v s 2.5 3.3 5.5 v operating temperature range ? 40 +125 c die temperature, t die 125 c object temperature, t obj see note (1) c (1) object temperature is application dependent. 6.4 thermal information TMP007 thermal metric (1) yzf (dsbga) unit 8 pins r ja junction-to-ambient thermal resistance 115.3 c/w r jc(top) junction-to-case (top) thermal resistance 0.4 c/w r jb junction-to-board thermal resistance 14.3 c/w jt junction-to-top characterization parameter 3.8 c/w jb junction-to-board characterization parameter 14.1 c/w r jc(bot) junction-to-case (bottom) thermal resistance n/a c/w (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 5 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 6.5 electrical characteristics at t die = 25 c, and v+ = +3.3 v (unless otherwise noted) parameter test conditions min typ max unit device performance responsivity (signal) t die = 0 c to 100 c, t obj = 0 c to 60 c 9 v/w 1-s conversion, t die = 0 c to 60 c, t obj = 0 c to sensor noise 300 nvrms 60 c noise equivalent power (nep) at 1 , t die = 0 c to 60 c, t obj = 0 c to 60 c 32 nw noise equivalent temperature difference (1) (netd) t die = 0 c to 60 c, t obj = 0 c to 60 c 90 mk noise equivalent temperature difference (netd) at f/1 (6 ), t die = 25 c, t obj = 0 c to 60 c 1.4 c absorber size 330 330 m reference system performance (1) t die = 20 c to 40 c, t obj = 20 c to 60 c 1 3 c object temperature accuracy (1) (error) t die = 0 c to 60 c, t obj = ? 15 c to 85 c 2 5 c temperature measurement t die die temperature range ? 40 +125 c t die accuracy (error) 0.5 1 c accuracy vs supply 0.1 0.2 c/v conversion time 0.25 second temperature resolution (object and local) 0.03125 c/lsb field of view (50% responsivity, full angle) 90 degrees digital pins v ih high-level input voltage 1.4 v v il low-level input voltage 0.4 v hysteresis 200 mv v ol low-level output voltage, sda i out = ? 6 ma 0.05 0.4 v output alert logic low sink i out = ? 6 ma 0.200 v i in input current 0 v < v in < 5.5 v ? 1 +1 a input capacitance 3 pf smbus frequency 0.01 2.5 mhz timeout time 25 28 35 ms power supply v+ operating supply range 2.5 5.5 v por power-on reset 1.9 v nonvolatile memory programming voltage 2.5 5.5 v nonvolatile memory programming current supply current pulse time < 3 ms 2.8 ma serial bus inactive, continuous conversion 270 350 a low power conversion, serial bus inactive, cr2 = 85 (2) a i q quiescent current 1, cr1 = x, cr0 = 1 low power conversion serial bus active, cr2 = 1, 60 (2) a cr1 = 1, cr0 = 0 serial bus inactive 2 4 a i sd shutdown current serial bus active, 400 khz 36 a (1) this parameter is tested in a fully-settled setup with no transients, in front of a black body, = 0.95, field of view (fov) = 110 , with the recommended layout , and after system calibration with a common set of coefficients loaded. (2) average current over complete measurement cycle. 6 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 6.6 typical characteristics at t die = 25 c, and v+ = +3.3 v (unless otherwise noted) figure 1. relative spectral response vs wavelength figure 2. responsivity vs angle note: the responsivity is the slope of the lines. figure 3. sensor voltage vs ir power over t die figure 4. sensor noise vs t obj and t die figure 5. nep vs t obj and t die figure 6. netd for reference system at f/1 over t die copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 7 product folder links: TMP007 0 10 20 30 40 50 60 70 0 20 40 60 80 nep (nw) object temperature ( ? c) 60c 40c 20c 0c c010 0 20 40 60 80 100 120 0 20 40 60 80 netd (mk) object temperature ( ? c) 0c 20c 40c c011 400 300 200 100 0 100 200 300 400 40 20 0 20 40 sensor voltage (v) ir power (w) 60c 40c 20c 0c c007 responsivity - 9 v/w 0 200 400 600 800 20 0 20 40 60 80 100 sensor rms noise (nv) object temperature ( ? c) 60c 40c 20c 0c c008 0.0 0.2 0.4 0.6 0.8 1.0 1.2 4.0 8.0 12.0 16.0 relative response wavelength (m) c005 20 30 40 50 60 70 80 90 100 110 90 75 60 45 30 15 0 15 30 45 60 75 90 responsivity (%) angle ( ? ) c001 field of view
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com typical characteristics (continued) at t die = 25 c, and v+ = +3.3 v (unless otherwise noted) note: in the last three conversion modes, there is a change in sensor voltage, and a different set of calibration coefficients may be needed depending on the accuracy required. figure 7. sensor noise at t die = 25 c and 75 c vs sample figure 8. t die accuracy time 2.5 v < v s < 5.5 v figure 9. t die psrr vs t die figure 10. accuracy with unit calibration (0 c to 60 c) figure 11. accuracy with common calibration (0 c to 60 c) figure 12. por voltage vs t die 8 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 0 10 20 30 40 50 60 70 80 tobj accuracy- common calibration ( ? c) object temperaturej ( ? c) 0c c 20c c 40c c 60c c c018 0.0 0.5 1.0 1.5 2.0 2.5 50 25 0 25 50 75 100 125 150 por (v) t die ( ? c) c036 0 5 10 15 20 25 30 35 40 45 50 50 25 0 25 50 75 100 125 150 t die psrr (m ? c/v) t die ( ? c) psrr c014 -3.00 -2.00 -1.00 0.00 1.00 2.00 3.00 0 10 20 30 40 50 60 70 80 tobj accuracy - unit calibration ( ? c) object temperature ( ? c) 0c u 20c u 40c u 60c u c017 -2.00 -1.50 -1.00 -0.50 0.00 0.50 1.00 1.50 2.00 50 25 0 25 50 75 100 125 150 t die error ( ? c) t die ( ? c) error (c) 1 - 1 c013 0.0 0.2 0.4 0.6 0.8 1.0 0 1 2 3 4 5 6 7 relative rms noise conversion rate code noise 25c noise 75c c012
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 typical characteristics (continued) at t die = 25 c, and v+ = +3.3 v (unless otherwise noted) figure 13. output pin voltage vs current figure 14. shutdown current vs t die figure 15. supply current vs t die (continuous conversion) figure 16. conversion frequency stability vs t die copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 9 product folder links: TMP007 150 175 200 225 250 275 300 325 350 50 25 0 25 50 75 100 125 150 supply current (a) t die ( ? c) v = 5.5 v v = 4.4 v v = 3.3 v v = 2.5 v c039 -1.00 -0.80 -0.60 -0.40 -0.20 0.00 0.20 0.40 0.60 0.80 1.00 50 25 0 25 50 75 100 125 150 frequency drift (%) t die ( ? c) c040 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0 5 10 15 20 25 pin voltage (v) pin current (ma) alert pin sda pin c037 0 1 2 3 4 5 50 25 0 25 50 75 100 125 150 shutdown current (a) t die ( ? c) v = 5.5 v v = 4.4 v v = 3.3 v v = 2.5 v c039
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7 detailed description 7.1 overview the TMP007 is an integrated digital thermopile temperature sensor in a wafer chip-scale package (wcsp) that detects the temperature of a remote object by its infrared (ir) emission. it is optimal for thermal management and thermal protection applications where remote noncontact temperature sensing is desired. the TMP007 is two-wire and smbus interface compatible, and is specified over the temperature range of ? 40 c to 125 c. the TMP007 contains registers for holding configuration and calibration information, temperature limits, local temperature, t die , measurement results, and the thermopile voltage measurement result. the local temperature and the thermopile voltage measurements are used by the math engine to calculate the object temperature, which is then stored in the respective register. in addition, the TMP007 has an internal eprom memory that can be used to store the factory default values and custom values for coefficients and calibration parameters. the values in eprom can be transferred to the registers either individually or as a complete set. the sda (and scl, if driven by an open-drain output) interface pin requires a pull-up resistor (10 k , typical) as part of the communication bus. the alert pin is an open-drain output that must also use a pull-up resistor, or be left floating if unused. if desired, alert may be shared with other devices for a wired-or implementation. 7.2 functional block diagram 7.3 feature description the TMP007 senses the ir radiation that is emitted by all objects. the spectrum of the radiation depends only on the temperature and is given by planck ? s law, as shown in equation 1 : where ? h = planck ? s constant ? c = speed of light ? k b = boltzmann ? s constant ? = wavelength in microns (1) 10 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 v+ agnd dgnd 16-bit adc gain local temperature ir thermopile sensor voltage reference digital control and math engine i 2 c and smbus compatible digital interface alert adr0 adr1 scl sda TMP007 eeprom t hot t cold t hot t hot t hot + ( ) 2 2 5 k t b 2hc 1 b t, watts / cm / m hc e 1 l ? ? ? ? l = m l ? l ? - ?
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 feature description (continued) the intensity of radiation from the object is determined by the emisivity ( ), a material-dependent property that scales the spectral response so that 0 < < 1. for an ideal black body, the radiation is at a maximum for a given temperature and = 1. the temperature is measured on the kelvin scale where 0 k is absolute zero, or ? 273.15 c. room temperature (25 c) is approximately 298.13 k. the emission spectra for objects at or near room temperature are shown in figure 17 . for these temperatures, the majority of the radiation emitted is in the wavelength range of 3 m to 20 m. figure 17. black body emission spectrum and response 7.3.1 spectral responsivity the TMP007 is optimized to sense ir radiation emitted by objects from approximately 250 k ( ? 23 c) to 400 k (127 c), with maximum sensitivity from approximately 4 m to 16 m. the relative spectral response of the TMP007 is shown in figure 18 . figure 18. relative spectral response vs wavelength copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 11 product folder links: TMP007 0.0 0.2 0.4 0.6 0.8 1.0 1.2 4.0 8.0 12.0 16.0 relative response wavelength (m) c005 0.000 0.005 0.010 0.015 0.020 0.025 0 5 10 15 20 spectral radiant exitance ( w/(cm m) 2 wavelength (m) 450 k 400 k 350 k 300 k 250 k c019 16 m 4 m
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com feature description (continued) 7.3.2 field of view and angular response the TMP007 senses all radiation within a defined field of view (fov). the fov (or full-angle of ) is defined as 2 . the TMP007 contains no optical elements, and thus senses all radiation within the hemisphere to the front of the device. figure 2 shows the angular dependence of the sensor response and the relative power for a circular object that subtends a half angle of phi ( ). figure 19 defines the angle in terms of object diameter and distance. figure 19 assumes that the object is well approximated as a plane that is perpendicular to the sensor axis. figure 19. fov geometry definition in this case, the maximum contribution is from the portion of the object directly in front of the TMP007 ( = 0), with the sensitivity per solid angle, dr/d decreases as increases. approximately 50% of the energy sensed by the TMP007 is within a fov ( ) = 90 . this discussion is for illustrative purposes only; in practice the angular response (dr/d ) of the TMP007 to the object is affected by the object orientation, the number of objects, and the precise placement relative to the TMP007. figure 20 shows the thermopile sensor dimensions. note: thermopile sensor is centered in the device. figure 20. thermopile sensor dimensions 12 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 sensor 1.9 mm 0.33 mm 0.33 mm 0.165 mm 0.165 mm 1.9 mm TMP007 object d - d sensor
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 feature description (continued) 7.3.3 thermopile principles and operation the TMP007 senses radiation by absorbing the radiation on a hot junction. the thermopile then generates a voltage proportional to the temperature difference between the hot junction, t hot , and the cold junction, t cold . figure 21. principle of thermopile operation the cold junction is thermally grounded to the die, and is effectively t die , the die temperature. in thermal equilibrium, the hot junction is determined by the object temperature, t obj . the energy emitted by the object, e obj , minus the energy radiated by the die, e die , determines the temperature of the hot junction. the output voltage, v out , is therefore determined by the relationship shown in equation 2 : where ? c is a constant depending on the design of the sensing element. (2) note that the sensor voltage is related to both the object temperature and the die temperature. a fundamental characteristic of all thermopiles is that they measure temperature differentials , not absolute temperatures. the TMP007 contains a highly-accurate, internal temperature sensor to measure t die . knowing t die and v sensor enables the TMP007 to estimate t obj . for each 250-ms conversion cycle, the TMP007 measures a value for v sensor and for t die , calculates t obj , and then places the values in the respective registers. bits cr2 to cr0 determine the number of local and sensor analog-to-digital converter (adc) results to average before the object temperature is calculated. after power-on reset (por), the TMP007 starts in four conversions per second (mode 010). in general, for a mode with n conversions, the local temperature, t die , result is updated at the end of the nth adc conversion with the value shown in equation 3 : (3) similarly, the sensor voltage result is updated at the end of the nth sensor adc conversion with the value shown in equation 4 : (4) these results are then used in the object temperature calculation by the math engine, which updates the object temperature result register. the total conversion time and averages per conversion can be optimized to select the best combination of update rate versus noise for an application. additionally, low-power conversion mode is available. in cr settings 101, 110, and 111, the device inserts a standby time before the beginning of the next conversion or conversions. the method and requirements for estimating t obj are described in the next section. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 13 product folder links: TMP007 n sensor x x 1 1 v sensor conversion n = = ? n die x x 1 1 t local temp conversion n = = ? out sensor hot cold obj die v v c (t t ) (t 4 t 4) = = - - thermopile heat absorbor cold junction t hot t cold t hot t hot t hot e hot ? t die 4 e obj ? t obj 4 +
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com feature description (continued) 7.3.4 object temperature calculation the TMP007 generates a sensor voltage, v sensor , in register 00h that is related to the energy radiated by the object. for an ideal situation, the stefan-boltzman law relates the energy radiated by an object to its temperature by the relationship shown in equation 5 : where ? = stefan-boltzman constant = 5.67 10 -12 w/(cm 2 k 4 ) ? = emissivity, 0 < < 1, an object dependent factor, = 1 for a perfect black body (5) a similar relationship holds for the sensing element itself that radiates heat at a rate determined by t die . the net energy absorbed by the sensor is then given by the energy absorbed from the object minus the energy radiated by the sensor, as shown in equation 6 : (6) in an ideal situation, the sensor voltage relates to object temperature as shown in equation 7 : (7) where ? s is a system-dependent parameter incorporating the object emissivity ( ), fov, and sensor characteristics. the parameters s0, a1, and a2 are used in determining s. ? f(v obj ) is a function that compensates for heat flow other than radiation, such as convection and conduction, from nearby objects. the parameters b0, b1, and b2 are used to tune this function to a particular system and environment. (8) the coefficients affect object temperature measurement as described in table 1 . table 1. calibration coefficient definitions coefficient purpose calibration comment s0 fov and emissivity of object application and object default values based on black body with = 0.95, and dependent 110 fov a1, a2 device properties factory set default values based on typical sensor characteristics c2 device properties factory set default values based on typical sensor characteristics b0, b1, b2 corrects for energy sources environment dependent calibrate in end-application environment 14 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 { } 4 obj 4 obj die ? v t t s ? ? = + ? ? ? 4 4 sensor obj die v t t = + es ( ) 4 4 sensor absorbed radiated obj die v e e t t - = es - 4 rad obj energy t = es
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.3.5 calibration the TMP007 default coefficients are calibrated with a black body of emissivity, = 0.95, and an fov ( ) = 110 . use these coefficients for applications where the object emissivity and geometry satisfy these conditions. for applications with different object emissivity or geometry, calibrate the TMP007 to accurately reflect the object temperature and system geometry. accuracy is affected by device-to-device or object-to-object variation. for the most demanding applications, calibrate each device individually. as an overview the calibration procedure includes: 1. defining the environmental variation range (die and object temperature range, supply voltage, temperature change speed, sampling rate and so on). 2. making the die temperature measurements and ir sensor voltage measurements over the environmental range. 3. generate an optimal set of coefficients based on the collected data set. 4. load the coefficients into the TMP007 coefficients register. the object temperature register reflects the best fit from the calibration process. perform validation measurements because accuracy may vary over the environmental range. if the object temperature measurement error is not acceptable, repeat the calibration process using more environment points, data averaging, or narrow the temperature range of t die or t obj . 5. after a suitable set of coefficients is obtained, they can be stored in nonvolatile memory. each coefficient register can be programmed up to eight times. after por, the last stored coefficient value is copied from the nonvolatile memory into the coefficient register. the best temperature precision is available if every device is calibrated individually. alternatively, if all the units in the application use the same coefficients, then calibrate a statistically significant number of devices, and load averaged coefficient values in nonvolatile memory. recalibration may be required under any or all of the following conditions: 1. board layout changed. 2. object or objects in the field of view changed. 3. object distance or object surface changed. 4. angle between device surface and direction to the object changed. 5. object and local temperature range changed outside the environmental calibration range. 6. object and local temperature transients significantly changed. 7. supply voltage changed more than 1 v. 8. air convection or conduction near the device changed. for further information and methods for calibration, refer to sbou142 ? TMP007 calibration guide . copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 15 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7.3.6 sensor voltage format the TMP007 provides 16 bits of data in binary twos complement format. the positive full-scale input produces an output code of 7fffh and the negative full-scale input produces an output code of 8000h. the output clips at these codes for signals that exceed full-scale. table 2 summarizes the ideal output codes for different input signals. figure 22 illustrates code transitions versus input voltage. full-scale is a 5.12-mv signal. the lsb size is 156.25 nv. table 2. input signal versus ideal output code (1) sensor signal voltage output code fs (2 15 ? 1) / 2 15 5.12 mv 7fffh fs / 2 15 156.25 nv 0001h 0 0 v 0000h ? fs / 2 15 ? 156.25 nv ffffh ? fs ? 5.12 mv 8000h (1) fs = full-scale value. figure 22. code transition diagram 16 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 7fffh output code - fs ? 0 ? fs sensor voltage (ain ain ) - p n 7ffeh 0001h ? 0000h8000h ffffh 8001h ? - fs 2 - 1 15 2 15 fs 2 - 1 15 2 15
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.3.7 temperature format the temperature register data format of the TMP007 is reported in a binary twos complement signed integer format, as table 3 shows, with 1 lsb = (1 / 32) c = 0.03125 c. table 3. temperature data format temperature ( c) digital output (binary) shifted hex 150 0100 1011 0000 0000 12c0 125 0011 1110 1000 0000 0fa0 100 0011 0010 0000 0000 0c80 80 0010 1000 0000 0000 0a00 75 0010 0101 1000 0000 0960 50 0001 1001 0000 0000 0640 25 0000 1100 1000 0000 0320 0.03125 0000 0000 0000 0100 0001 0 0000 0000 0000 0000 0000 ? 0.03125 1111 1111 1111 1100 ffff ? 0.0625 1111 1111 1111 1000 fffe ? 25 1111 0011 0111 0000 fcdc ? 40 1110 1011 1111 1100 faff ? 55 1110 0100 0111 1100 f91f to convert the integer temperature result of the TMP007 to degrees celsius, right-shift the result by two bits. then perform a divide-by-32 of t die and t obj , the 14-bit signed integers contained in the corresponding registers. the sign of the temperature is the same as the sign of the integer read from the TMP007. in twos complement notation, the msb is the sign bit. if the msb is 1, the integer is negative and the absolute value can be obtained by inverting all bits and adding 1. an alternate method of calculating the absolute value of negative integers is abs(i) = i xor ffffh + 1. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 17 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7.3.8 serial interface the TMP007 operates only as a slave device on the serial bus. connections to the bus are made using the scl input and open-drain i/o sda line. the sda and scl pins feature integrated spike suppression filters and schmitt triggers to minimize the effects of input spikes and bus noise. the TMP007 supports the transmission protocol for both fast and fastplus (1 khz to 1 mhz) and high-speed (1 mhz to 2.5 mhz) mode. all data bytes are transmitted msb first. at higher speeds, thermal dissipation affects device operation, including accuracy. 7.3.8.1 bus overview the device that initiates a transfer is called a master , and the devices controlled by the master are slaves . the bus must be controlled by a master device that generates the serial clock (scl), controls the bus access, and generates the start and stop conditions. to address a specific device, a start condition is initiated, indicated by pulling the data-line (sda) from a high-to- low logic level while scl is high. all slaves on the bus shift in the slave address byte, with the last bit indicating whether a read or write operation is intended. during the ninth clock pulse, the slave being addressed responds to the master by generating an acknowledge and pulling sda low. data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. during data transfer sda must remain stable while scl is high, as any change in sda while scl is high will be interpreted as a control signal. once all data has been transferred, the master generates a stop condition, indicated by pulling sda from low to high while scl is high. 7.3.8.2 serial bus address to communicate with the TMP007, the master must first address slave devices via a slave address byte. the slave address byte consists of seven address bits, and a direction bit indicating the intent of executing a read or write operation. the TMP007 features two address pins allowing up to eight devices to be connected on a single bus. pin logic levels and the corresponding address values are described in table 4 . table 4. address pins and slave addresses adr1 adr0 smbus addresses 0 0 1000000 0 1 1000001 0 sda 1000010 0 scl 1000011 1 0 1000100 1 1 1000101 1 sda 1000110 1 scl 1000111 7.3.8.3 writing and reading operations accessing a particular register on the TMP007 is accomplished by writing the appropriate value to the pointer register. the value for the pointer register is the first byte transferred after the slave address byte with the r/w bit low. every write operation to the TMP007 requires a value for the pointer register (see figure 24 ). when reading from the TMP007, the last value stored in the pointer register by a write operation is used to determine which register is read by a read operation. to change the register pointer for a read operation, write a new value to the pointer register. this action is accomplished by issuing a slave address byte with the r/w bit low, followed by the pointer register byte. no additional data are required. the master then generates a start condition and sends the slave address byte with the r/w bit high to initiate the read command. see figure 25 for details of this sequence. if repeated reads from the same register are desired, it is not necessary to continually send the pointer register byte because the TMP007 remembers the pointer register value until it is changed by the next write operation. note that register bytes are sent most significant byte first, followed by the least significant byte. 18 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.3.8.4 slave mode operations the TMP007 operates as a slave receiver or slave transmitter. 7.3.8.4.1 slave receiver mode the first byte transmitted by the master is the slave address, with the r/w bit low. the TMP007 then acknowledges reception of a valid address. the next byte transmitted by the master is the pointer register. the TMP007 then acknowledges reception of the pointer register byte. the next two bytes are written to the register addressed by the pointer register. the TMP007 acknowledges reception of both data bytes. the master terminates data transfer by generating a start or stop condition. 7.3.8.4.2 slave transmitter mode: the first byte is transmitted by the master and is the slave address, with the r/w bit high. the TMP007 acknowledges reception of a valid slave address. the next two bytes transmitted by the TMP007 are the value in the register indicated by the pointer register. the master acknowledges reception of both data bytes. the master terminates the data transfer by generating a not-acknowledge bit on reception of any data byte, or generating a start or stop condition. 7.3.8.5 smbus alert function the TMP007 supports the smbus alert function. when the TMP007 is operating in interrupt mode (tm = 1), the alert pin of the TMP007 can be connected as an smbus alert signal. when a master senses that an alert condition is present on the alert line, the master sends an smbus alert command (00011001) on the bus. if the alert pin of the TMP007 is active, the devices acknowledge the smbus alert command and respond by returning its slave address on the sda line. the eighth bit (lsb) of the slave address byte indicates if the cause of the alert condition is caused by the temperature exceeding t high or falling below t low . this bit is high if the temperature is greater than t high . this bit is low if the temperature is less than t low . see figure 26 for details of this sequence. if multiple devices on the bus respond to the smbus alert command, arbitration during the slave address portion of the smbus alert command determines which device clears the alert status. if the TMP007 wins the arbitration, its alert pin becomes inactive at the completion of the smbus alert command. if the TMP007 loses the arbitration, the TMP007 alert pin remains active. 7.3.8.6 general call the TMP007 responds to a two-wire general call address (0000000) if the eighth bit is 0. the device acknowledges the general call address and respond to commands in the second byte. if the second byte is 00000110, the TMP007 internal registers are reset to power-up values. 7.3.8.7 high-speed (hs) mode in order for the two-wire bus to operate at frequencies above 400 khz, the master device must issue an smbus hs-mode master code (00001xxx) as the first byte after a start condition to switch the bus to high-speed operation. the TMP007 does not acknowledge this byte, but switches its input filters on sda and scl, and its output filters on sda to operate in hs-mode, allowing transfers at up to 2.5 mhz. after the hs-mode master code has been issued, the master transmits a two-wire slave address to initiate a data transfer operation. the bus continues to operate in hs-mode until a stop condition occurs on the bus. upon receiving the stop condition, the TMP007 switches the input and output filters back to fast-mode operation. 7.3.8.8 timeout function the TMP007 resets the serial interface if scl is held low for 30 ms (typ) between a start and stop condition. the TMP007 releases the bus if scl is pulled low and waits for a start condition. to avoid activating the timeout function, maintain a communication speed of at least 1 khz for scl operating frequency. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 19 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7.3.8.9 two-wire timing the TMP007 is two-wire and smbus compatible. figure 23 to figure 26 describe the various operations on the TMP007. parameters for figure 23 are defined in table 5 . bus definitions are: bus idle both sda and scl lines remain high. start data transfer a change in the state of the sda line, from high to low, while the scl line is high defines a start condition. each data transfer is initiated with a start condition. stop data transfer a change in the state of the sda line from low to high while the scl line is high defines a stop condition. each data transfer is terminated with a repeated start or stop condition. data transfer the number of data bytes transferred between a start and a stop condition is not limited, and is determined by the master device. the receiver acknowledges the transfer of data. it is also possible to use the tmp75b for single-byte updates. to update only the ms byte, terminate communication by issuing a start or stop condition on the bus. acknowledge each receiving device, when addressed, must generate an acknowledge bit. a device that acknowledges must pull down the sda line during the acknowledge clock pulse so that the sda line is stable low during the high period of the acknowledge clock pulse. setup and hold times must be taken into account. when a master receives data, the termination of the data transfer can be signaled by the master generating a not-acknowledge (1) on the last byte transmitted by the slave. table 5. two-wire timing requirements fast mode high-speed mode unit min max min max f (scl) scl operating frequency 0.001 0.4 0.001 2.5 mhz t (buf) bus free time between stop and start condition 1300 260 ns t (hdsta) hold time after repeated start condition. 600 160 ns after this period, the first clock is generated. t (susta) repeated start condition setup time 600 160 ns t (susto) stop condition setup time 600 160 ns t (hddat) data hold time 0 900 0 150 ns t (sudat) data setup time 100 30 ns t (low) scl clock low period 1300 260 ns t (high) scl clock high period 600 60 ns t f , t r ? sda data fall and rise time 300 80 ns t f , t r ? scl clock fall and rise time 300 40 ns t r rise time for scl 100 khz 1000 ns 20 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.3.8.10 two-wire timing diagrams figure 23. two-wire timing diagram (1) the value of a2, a1, and a0 are determined by the adr1 and adr0 pins. figure 24. two-wire timing diagram for write word format copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 21 product folder links: TMP007 frame 1 two-wire slave address byte frame 2 pointer register byte frame 4 data byte 2 1 start by master ack by device ack by device ack by device stop by master 1 9 1 1 d7 d6 d5 d4 d3 d2 d1 d0 9 frame 3 data byte 1 ack by device 1 d15 sda (continued) scl (continued) d14 d13 d12 d11 d10 d9 d8 9 9 sda scl 0 0 0 a1 (1) a0 (1) r/w 0 0 p5 p4 p3 p2 p1 p0 ? ? a2 (1) scl sda t (low) t r t f t (hdsta) t (hdsta) t (hddat) t (buf) t (sudat) t (high) t (susta) t (susto) p s s p
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com (1) the value of a0, a1, and a2 are determined by the connections of the corresponding pins. (2) master should leave sda high to terminate a single-byte read operation. (3) master should leave sda high to terminate a two-byte read operation. figure 25. two-wire timing diagram for read word format (1) the value of a0, a1, and a2 are determined by the connections of the corresponding pins. figure 26. timing diagram for smbus alert 22 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 frame 1 smbus alert response address byte frame 2 slave address from device start by master ack by device from device nack by master stop by master 1 9 1 9 sda scl alert 0 0 0 1 1 0 0 r/ w 1 0 0 0 status a1 (1) a0 (1) a2 (1) frame 3 two-wire slave address byte frame 4 data byte 1 read register start by master ack by device ack by master (2) from device 1 9 1 9 ? ? sda (continued) scl (continued) sda (continued) scl (continued) 1 0 0 a1 (1) a0 (1) r/w d15 d14 d13 d12 d11 d10 d9 d8 frame 5 data byte 2 read register stop by master ack by master (3) from device 1 9 d7 d6 d5 d4 d3 d2 d1 d0 a2 (1) frame 1 two-wire slave address byte frame 2 pointer register byte 1 start by master ack by device ack by device 1 9 1 9 sda scl 0 0 0 a1 (1) a0 (1) r/w 0 0 p5 p4 p3 p2 p1 p0 ? ? a2 (1) 0
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.4 device functional modes 7.4.1 temperature transient correction because the measured object temperature depends on t die , transient thermal events that change the die temperature affect the measurement. to compensate for this effect, the TMP007 math engine incorporates a transient correction option for use in applications where a thermal transient is anticipated. when transient correction is turned on, a filter with programmable coefficients is used to modify the sensor voltage result before the object temperature is calculated. this function helps reduce the jump in the object temperature result when there are large transients of the local die temperature, t die . the compensation incorporates the rate of change of t die and of v obj . the modified value for the sensor voltage used in v sensor to calculate the object temperature is shown in equation 9 : where ? tc0 and tc1 are weighting coefficients programmable using the registers. ? t die_slope is the change in die temperature with time. ? v obj_slope is the change in sensor voltage with time. (9) as a general guideline, turn on transient correction when the local temperature is changing at a rate greater than 1.5 c/min. when transient correction is on, the function corrects transients up to approximately 20 c/min. turning on the transient correction also turns on the output filter shown in equation 10 : (10) if only the use of the output filter is desired without the input transient correction arithmetic, set the tc0 and tc1 coefficient values to 0 with tc bit in configuration register set to 1. when transition correction is on, the response to a step change has a time constant of approximately five times the sampling time. when transient correction is on, the math engine modifies the sensor voltage result based on the transient correction equations. the nonmodified sensor voltage can be recovered with tc on by setting the tc1 and tc0 coefficients to 0. the output filtering cannot be turned off with tc bit set to 1. 7.4.2 alert modes: interupt (int) and comparator (comp) the int mode maintains the alert condition until a host controller clears the alert condition by reading the status register. this mode is useful when an external microcontroller is actively monitoring TMP007 as part of a thermal management system. the comp mode asserts the alert pin and flags whenever the alert condition occurs, and deasserts the alert pin and flags without external intervention when the alert condition is no longer present this mode is often used to notify an external agent of an alert condition. when servicing an alert from the TMP007, in some cases it may be useful to validate the alert condition by checking the status of the ndv, mem_crpt, and data_ovf flags. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 23 product folder links: TMP007 obj _ final[n] obj[n] obj _ final[n 1] t t 0.2 t 0.8 - = + obj obj _ measured die _ slope obj _ slope v v tc0 t tc1 v = + +
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com device functional modes (continued) 7.4.2.1 int mode (int/comp = 0) in this mode the high and low limits form a limit window. the alrten bit must be asserted if the alert pin functionality is desired. if the calculated temperature is above the high limit or below the low limit at the end of a conversion its respective enabled flag is asserted. figure 27. int mode after the flag is asserted, it can only be cleared by a read of the status register, which clears the flag and the pin. the alert pin can also be cleared by the smb alert response command (see the smbus alert function section); however, this action does not clear the flag. 7.4.2.2 comp mode (int/comp = 1) in comp mode, the limits are used to form an upper limit threshold detector. if the calculated temperature is above the high limit, the high limit flag is asserted. the high limit flag is then deasserted only after the temperature goes below the low limit. the low limit register value determines the degree of hysteresis in the comp function. in comp mode, only the high limit enable has effect on the limit flags. the low limit enable flag does not have any effect on the low limit flags and the low limit flags always read 0. in this mode, the flags are asserted and deasserted only at the end of a conversion and cannot be cleared by a status register read or an smb alert response. figure 28. comp mode 24 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 high limit low limit conversions done alert flag status register reads alert pin smbus alert response violating condition: limit mode violating condition: window mode high limit low limit alert flag status register reads alert pin smbus alert response conversion completed
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 device functional modes (continued) 7.4.3 nonvolatile memory description 7.4.3.1 programming the nonvolatile memory the TMP007 has an internal memory that can be programmed eight times. this internal memory stores power- on reset (por) values for all writeable registers in the register map. the default por values for each register are used if their memory location has not been overwritten through the i 2 c interface. the stored values in memory are loaded at power up, software reset, general load command, single load command, or smbus general call reset. on a memory store, bits nwr2:0 are incremented and indicate the number of writes remaining, as described in table 6 . note the ambiguity in condition for code 000. every memory location is individually writable, and the value returned for nwr depends on how many times that individual memory location has previously been written. table 6. number of writes remaining to nonvolatile memory nwr_2 nwr_1 nwr_0 total number writes performed total number of writes remaining 0 0 0 0 8 0 0 0 1 7 0 0 1 2 6 0 1 0 3 5 0 1 1 4 4 1 0 0 5 3 1 0 1 6 2 1 1 0 7 1 1 1 1 8 0 to program the memory, write the desired value in the appropriate register address. then write to the memory access register (2ah) with 6ah in the msb (b15:b8), the 5-bit register address in b7:b3, and 1 in b1 (the single write bit in the same write operation). if 6ah prefix code is not written, then the write operation is ignored. a sample flow is shown in figure 29 . figure 29. sample flow write value to target register write to memory access register address 2ah 2ah 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 bit name nwr_2 nwr_1 nwr_0 mem. crpt ? ? ? ? adr4 adr3 adr2 adr1 adr0 gen load mem store sin load. value 0 1 1 0 1 0 1 0 a4 a3 a2 a1 a0 0 1 0 clear target register write to memory access register (2ah) to load value from memory to target register 2ah 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 bit name nwr_2 nwr_1 nwr_0 mem. crpt ? ? ? ? adr4 adr3 adr2 adr1 adr0 gen load mem store sin load. value 0 1 1 0 1 0 1 0 a4 a3 a2 a1 a0 0 0 1 read target register to verify programming copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 25 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7.4.3.2 memory store and register load from memory the internal memory is accessed and the contents transferred to the registers on power up, single load, general load and reset operations. the transfer from internal memory to the registers takes 3 ms, during which the serial interface is disabled. the serial interface does not acknowledge while the memory values are being loaded to the registers, and the device stops any data conversions in progress. the loaded values programmed in the register can be overwritten through the serial bus after the load. general load can be used to load all the registers from memory values at once. the nwr bits indicate the number of times a particular memory location has been written to. it is important to note that after a value has been overwritten in the memory, previous values are no longer accessible. only the most recently written value is transferred from the memory to the register or registers. 7.5 register maps the TMP007 registers contain the results of measurements, status information, temperature limit information for setting alert thresholds for both interrupt and compare modes, and the values of the coefficients and parameters currently being used. table 7. internal register description register reset address value register name register description 00h 0000h v sensor sensor voltage result sensor voltage result register 01h 0000h t die local temperature result t die local temperature result register 02h 1440h configuration configuration register 03h 0000h t obj object temperature result t obj object temperature result register 04h 0000h status status register 05h 0000h status mask and enable mask and enable register 06h 7fc0h t obj object temperature high-limit t obj object temperature high-limit register 07h 8000h t obj object temperature low-limit t obj object temperature low-limit register 08h 7fc0h t die local temperature high-limit t die temperature high-limit register 09h 8000h t die local temperature low-limit t die temperature low-limit register 0ah 260eh s0 coefficient s0 coefficient register 0bh 0106h a1 coefficient a1 coefficient register 0ch ff9bh a2 coefficient a2 coefficient register 0dh ff3ah b0 coefficient b0 coefficient register 0eh ff71h b1 coefficient b1 coefficient register 0fh 0553h b2 coefficient b2 coefficient register 10h 0000h c2 coefficient c2 coefficient register 11h 0034h tc0 coefficient tc0 coefficient register 12h 0000h tc1 coefficient tc1 coefficient register 1eh 5449h manufacturer id manufacturer id register 1fh 0078h device id device id register 2ah 0e00h memory access memory access register 26 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 table 8. register map register description addr r/w bit description v sensor sensor 00h r v15 v14 v13 v12 v11 v10 v9 v8 v7 v6 v5 v4 v3 v2 v1 v0 voltage result t die local 01h r t13 t12 t11 t10 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? temperature result int/ configuration 02h r/w rst ? ? mod cr2 cr1 cr0 alrten alrtf tc ? ? ? ? ? comp t obj object 03h r t13 t12 t11 t10 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ndv temperature result mem data_ status 04h r alrtf crtf ohf olf ahf alf ndvf ? ? ? ? ? ? ? crpt ovf status mask and mem_ 05h r/w alrten crten ohen olen lhen llen dven ? ? ? ? ? ? ? ? enable c_en t obj object temperature high- 06h r/w t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? limit t obj object temperature low- 07h r/w t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? limit t die local temperature high- 08h r/w t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? limit t die local temperature low- 09h r/w t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? limit s0 coefficient 0ah r/w s0_15 s0_ s0_13 s0_12 s0_11 s0_10 s0_9 s0_8 s0_7 s0_6 s0_5 s0_4 s0_3 s0_2 s0_1 s0_0 a1 coefficient 0bh r/w a1_15 a1_14 a1_13 a1_12 a1_11 a1_10 a1_9 a1_8 a1_7 a1_6 a1_5 a1_4 a1_3 a1_2 a1_1 a1_0 a2 coefficient 0ch r/w a2_15 a2_14 a2_13 a2_12 a2_11 a2_10 a2_9 a2_8 a2_7 a2_6 a2_5 a2_4 a2_3 a2_2 a2_1 a2_0 b0 coefficient 0dh r/w b0_15 b0_14 b0_13 b0_12 b0_11 b0_10 b0_9 b0_8 b0_7 b0_6 b0_5 b0_4 b0_3 b0_2 b0_1 b0_0 b1 coefficient 0eh r/w b1_15 b1_14 b1_13 b1_12 b1_11 b1_10 b1_9 b1_8 b1_7 b1_6 b1_5 b1_4 b1_3 b1_2 b1_1 b1_0 b2 coefficient 0fh r/w b2_15 b2_14 b2_13 b2_12 b2_11 b2_10 b2_9 b2_8 b2_7 b2_6 b2_5 b2_4 b2_3 b2_2 b2_1 b2_0 c2 coefficient 10h r/w c_11 c_10 c_9 c_8 c_7 c_6 c_5 c_4 c_3 c_2 c_1 c_0 ? ? ? ? tc0 coefficient 11h r/w tc0_15 tc0_14 tc0_13 tc0_12 tc0_11 tc0_10 tc0_9 tc0_8 tc0_7 tc0_6 tc0_5 tc0_4 tc0_3 tc0_2 tc0_1 tc0_0 tc1 coefficient 12h r/w tc1_15 tc1_14 tc1_13 tc1_12 tc1_11 tc1_10 tc1_9 tc1_8 tc1_7 tc1_6 tc1_5 tc1_4 tc1_3 tc1_2 tc1_1 tc1_0 manufacturer id 1eh r id15 id14 id13 id12 id11 id10 id9 id8 id7 id6 id5 id4 id3 id2 id1 id0 device id 1fh r did11 did10 did9 did8 did7 did6 did5 did4 did3 did2 did1 did0 rid3 rid2 rid1 rid0 mem general mem single memory access 2ah r/w nwr_2 nwr_1 nwr_0 ? ? ? ? adr4 adr3 adr2 adr1 adr0 crpt load store load copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 27 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7.5.1 sensor voltage result register (address = 00h) [reset = 0000h] figure 30. sensor voltage result register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 v15 v14 v13 v12 v11 v10 v9 v8 v7 v6 v5 v4 v3 v2 v1 v0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 legend: r/w = read/write; r = read only; -n = value after reset v15 to v0 : sensor voltage result. bits 15:0 range: 5.12 mv resolution: 156.25 nv/lsb this is the digitized ir sensor voltage output in twos complement format. 7.5.2 t die local temperature result register (address = 01h) [reset = 0000h] figure 31. t die local temperature result register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t13 t12 t11 t10 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 0 0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 legend: r/w = read/write; r = read only; -n = value after reset t13 to t0: temperature result. bits 15 to 2. the data format is 14 bits, 0.03125 c per lsb in twos complement format. full scale allows a result of up to 256 c. reset value is 00h. 7.5.3 configuration register (address = 02h) [reset = 1440h] figure 32. configuration register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 int/ rst ? ? mod cr2 cr1 cr0 alrten alrtf tc ? ? ? ? ? comp r/w-0 r/w-0 r/w-0 r/w-1 r/w-0 r/w-1 r/w-0 r/w-0 r/w-0 r/w-1 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset note: writing to the configuration register will restart the adc conversion (unless the write is to put the device in shutdown mode) rst: software reset bit. bit 15 (write only) writing 1 to this bit generates a system reset that is the same as power on reset. it will reset all registers to default values including configuration register. this bit self-clears. any conversion in progress is terminated. mod: conversion mode select, bit 12 (read/write) mode mod power down 0 conversion on 1 (default) selects the conversion mode of the device. cr2 to cr0: conversion rate/averaging mode bits. bits 11 to 9 controls the number of conversions used to generate the value in the v sensor and t die registers. there are a number of conversion modes available. cr2 cr1 cr0 number of averages per total conversion time (s) i q a average conversion 0 0 0 1 0.26 270 0 0 1 2 0.51 270 0 1 0 4 (default) 1.01 270 0 1 1 8 2.01 270 1 0 0 16 4.01 270 1 0 1 1 1.0 (idle for 0.75) 85 1 1 0 2 4.0 ( idle for 3.5) 60 1 1 1 4 4.0 (idle for 3.0) 85 28 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 alrten: alert pin enable. bit 8 makes alert pin controlled by the alert flag bit. the alert pin is active low. the alrten bit is mirrored in the status mask and enable register. writing to the alrten bit in the status mask and enable register also sets this bit, and vice versa. alrtf: cumulative alert flag. bit 7 (read only) this flag is the logical or of all enabled flags, and is cleared when the status register is read in int mode or at the end of a conversion when all enabled flags are 0 in comp mode. it is mirrored in status register. tc: transient correction enable. bit 6 setting this bit turns on the transient correction enabling sensor voltage and object temperature output filtering. int/comp: int/comp mode. bit 5 the int/comp bit controls whether the limit flags are in interrupt (int) mode (0) or comparator (comp) mode (1). it controls the behavior of the limit flags (lh, ll, oh, ol) and the data invalid flag (ndvf) from the status register. 7.5.4 t obj object temperature result register (address = 03h) [reset = 0000h] figure 33. t obj object temperature result register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t13 t12 t11 t10 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ndv r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 legend: r/w = read/write; r = read only; -n = value after reset t13 to t0: temperature result. bits 15 to 2 the data format is twos complement, 14 bits, and 0.03125 c per lsb. full scale allows a result of up to 256 c. reset value is 00h. ndv: data invalid bit. bit 0 if this bit is set, it indicates that the calculated object temperature is not valid due to invalid operations in the math engine. the bit is reset in the next valid conversion. 7.5.5 status register (address = 04h) [reset = 0000h] the status register flags are activated whenever their limit is violated, and latch if the int/comp bit is in int mode (see configuration register). in int mode these flags are cleared only when the status register is read. if the flag is set from a previous conversion, and at the end of the next conversion, the corresponding limit is not violating anymore, the flag is not cleared when in int mode. in comp mode, these flags are set whenever the corresponding limit is violated at the end of a conversion, and cleared if they are not. figure 34. status register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 alrtf crtf ohf olf lhf llf nvdf mcrpt snrl ? ? ? ? ? ? ? r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 legend: r/w = read/write; r = read only; -n = value after reset alrtf: cumulative alert flag bit. bit 15 this flag is the logical or of all enabled flags, and is cleared when the status register is read in int mode or at the end of a conversion when all enabled flags are 0 in comp mode. crtf: conversion ready flag. bit 14 the conversion ready flag is provided to help coordinate one-shot conversions for temperature measurements. the bit is set after the local and object temperature conversions have completed and the results are ready to be read in the result registers. this flag can be cleared by reading the status register, writing to the configuration register or reading any of the results registers (t die , t obj , and so on). this flag is not affected by the int/comp bit setting and is always in latched mode. ohf: object temperature high limit flag. bit 13 this bit is set to 1 if the result in the object temperature register exceeds the value in the object temperature high limit register. in int mode, this bit is cleared when the status register is read. olf: object temperature low limit flag. bit 12 this bit is set to 1 if the result in the object temperature register is less than the value in the object temperature low limit register. in int mode, this bit is cleared when the status register is read. in comp mode, this bit is disabled and always reads 0. lhf: local temperature (t die ) high limit flag. bit 11 this bit is set to 1 if the result in the t die local temperature result register exceeds the value in the local temperature high limit register. in comp mode, the bit is cleared to 0 when the result in the t die local temperature result register is less than the object temperature low limit. in int mode, the bit is cleared when the status register is read. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 29 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com llf: local temperature (t die ) low limit flag. bit 10 this bit is set to 1 if the result in the t die local temperature result register goes below the value in the local temperature low limit register. in int mode, the bit is cleared when the status register is read. in comp mode, the bit is disabled and always reads 0. ndvf: data invalid flag. bit 9 if the calculated object temperature is invalid due to an internal error in the math engine or if sensor voltage is out of range, then data invalid flag is set. in int mode, this flag can only be cleared by reading the status register. in comp mode it is cleared at the end of the conversion if the calculated object temperature and sensor voltage are valid. mcrpt: memory corrupt flag. bit 8. this flag indicates an internal check on the memory failed. this check is automatically performed only on a general load of the registers from memory that is done right after a power on reset, general call reset, or software reset (rst bit in the configuration register), or by forcing loads through the memory access register. when this bit is set, it can only be cleared by a clean pass of the internal check on memory. mirror of this bit is in memory access register, bit 12. dof: ir data overflow data_ovf flag: bit 7. this flag indicates if sensor voltage measured is over range. combined with the data invalid bit, it tells why data is invalid. bits 6 to 0: not used. these bits always read 0. 7.5.6 status mask and enable register (address = 05h) [reset = 0000h] figure 35. status mask and enable register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 mem_c_ alrten crten ohen olen lhen llen dven ? ? ? ? ? ? ? ? en r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset alrten: alert flag enable bit. bit 15 0: alrtf flag in status register cannot activate alert pin. 1: alrtf flag any enabled flag in status register will activate alert pin. can also be set by its mirror in configuration register, bit 8. crten: temperature conversion ready enable bit. bit 14 0: crtf flag in status register cannot activate alrtf 1: crtf flag in status register will activate alrtf. ohen: object temperature high limit enable bit. bit 13 0: ohf flag in status register cannot activate alrtf. 1: ohf flag in status register will activate alrtf. olen: object temperature low limit enable bit. bit 12 int mode: 0: olf flag in status register cannot activate alrtf. 1: olf flag in status register will activate alrtf. comp mode: this bit is disabled in comp mode and will always read 0. lhen: t die temperature high limit enable bit. bit 11 0: ahf flag in status register cannot activate alrtf. 1: ahf flag in status register will activate alrtf in int mode llen: t die temperature low limit enable bit. bit 10 int mode (alert mode): 0: alf flag in status register cannot activate alrtf. 1: alf flag in status register will activate alrtf in int mode comp mode: this bit is disabled in comp mode and always read 0. dven: data invalid flag enable bit. bit 9 0: data invalid flag in status register cannot activate alrtf. 1: data invalid flag in status register will activate alrtf. mem_c_en: memory corrupt enable bit. bit 8 0: memory corrupt flag in status register cannot activate alrtf. 1: memory corrupt flag in status register will activate alrtf. 30 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.5.7 t obj object temperature high-limit register (address = 06h) [reset = 7fc0h] figure 36. t obj object temperature high-limit register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? r/w-0 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset t9 to t0: object temperature high limit. bits 15 to 6 the data format is 10 bits, 0.5 c per bit. full scale allows a result of up to 256c. twos complement data. bits 5 to 0: not used; these bits always read 0. 7.5.8 t obj object temperature low-limit register (address = 07h) [reset = 8000h] figure 37. t obj object temperature low-limit register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? r/w-1 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset t9 to t0: object temperature low limit. bits 15 to 6 the data format is 10 bits, 0.5 c per bit. full scale allows a result of up to 256c. twos complement data. bits 5 to 0: not used; these bits always read 0. 7.5.9 t die local temperature high-limit register (address = 08h) [reset = 7fc0h] figure 38. t die local temperature high-limit register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? r/w-0 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset t9 to t0: t die temperature high limit. bits 15 to 6 the data format is 10 bits with lsb of 0.5 c. full scale allows a result of up to 256c. twos complement data. bits 5 to 0: not used; these bits always read 0. 7.5.10 t die local temperature low-limit register (address = 09h) [reset = 8000h] figure 39. t die local temperature low-limit register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 t9 t8 t7 t6 t5 t4 t3 t2 t1 t0 ? ? ? ? ? ? r/w-1 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset t9 to t0: t die temperature low limit. bits 15 to 6. the data format is 10 bits with lsb of 0.5 c. full scale allows a result of up to 256c. twos complement data. bits 5 to 0: not used; these bits always read 0. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 31 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7.5.11 coefficient registers the values of the coefficient registers described above are used in the math engine. the range and resolution of the coefficients are shown in table 9 . the default coefficients, tc0 and tc1, are optimized for the default conversion mode (four averages per measurement). different acquisition modes may require different values for the tc0 and tc1 coefficients. table 9. coefficient range and resolution (1) register hex default address variable bits range resolution default values values 0a s0 16 0 ? 298e-15 lsb = 4.5475e-18 4.430e-14 0260eh 0b a1 16 125e-3 lsb = 3.8150e-06 9.995e-04 0106h 0c a2 16 1.9e-3 lsb = 5.9600e-08 ? 6.020e-06 ff9bh 0d b0 16 5.12e-3 lsb = 1.5625e-07 ? 3.094e-05 ff3ah 0e b1 16 20e-6 lsb = 6.1035e-10 ? 8.728e-08 ff71h 0f b2 16 312e-9 lsb = 9.5367e-12 1.300e-08 0553h 10 c2 12 97.65 lsb = 4.7680e-02 0 0000h 11 tc0 16 163e-3 lsb = 5.0000e-06 2.600e-04 0034h 12 tc1 16 1024 lsb = 3.1250e-02 0 0000h (1) all signed values are twos complement data. 7.5.11.1 s0 coefficient register (address = 0ah) [reset = 260eh] figure 40. s0 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 s0_15 s0_14 s0_13 s0_12 s0_11 s0_10 s0_9 s0_8 s0_7 s0_6 s0_5 s0_4 s0_3 s0_2 s0_1 s0_0 r/w-0 r/w-0 r/w-1 r/w-0 r/w-0 r/w-1 r/w-1 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-1 r/w-1 r/w-1 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset s0_15 to s0_0: s0 coefficient value. bits 15 to 0. range and resolution given in table 9 7.5.11.2 a1 coefficient register (address = 0bh) [reset = 0106h] figure 41. a1 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 a1_15 a1_14 a1_13 a1_12 a1_11 a1_10 a1_9 a1_8 a1_7 a1_6 a1_5 a1_4 a1_3 a1_2 a1_1 a1_0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-1 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-1 r/w-1 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset a1_15 to a1_0: a1 coefficient value. bits 15 to 0. twos complement format. range and resolution given in table 9 7.5.11.3 a2 coefficient register (address = 0ch) [reset = ff9bh] figure 42. a2 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 a2_15 a2_14 a2_13 a2_12 a2_11 a2_10 a2_9 a2_8 a2_7 a2_6 a2_5 a2_4 a2_3 a2_2 a2_1 a2_0 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-0 r/w-0 r/w-1 r/w-1 r/w-0 r/w-1 r/w-1 legend: r/w = read/write; r = read only; -n = value after reset a2_15 to a2_0: a2 coefficient value. bits 15 to 0 twos complement format. range and resolution given in table 9 32 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.5.11.4 b0 coefficient register (address = 0dh) [reset = ff3ah] figure 43. b0 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 b0_15 b0_14 b0_13 b0_12 b0_11 b0_10 b0_9 b0_8 b0_7 b0_6 b0_5 b0_4 b0_3 b0_2 b0_1 b0_0 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-0 r/w-0 r/w-1 r/w-1 r/w-1 r/w-0 r/w-1 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset b0_15 to b0_0: b0 coefficient value. bits 15 to 0 twos complement format. range and resolution given in table 9 7.5.11.5 b1 coefficient register (address = 0eh) [reset = ff71h] figure 44. b1 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 b1_15 b1_14 b1_13 b1_12 b1_11 b1_10 b1_9 b1_8 b1_7 b1_6 b1_5 b1_4 b1_3 b1_2 b1_1 b1_0 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-1 r/w-0 r/w-1 r/w-1 r/w-1 r/w-0 r/w-0 r/w-0 r/w-1 legend: r/w = read/write; r = read only; -n = value after reset b1_15 to b1_0: b1 coefficient value. bits 15 to 0 twos complement format. range and resolution given in table 9 7.5.11.6 b2 coefficient register (address = 0fh) [reset = 0553h] figure 45. b2 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 b2_15 b2_14 b2_13 b2_12 b2_11 b2_10 b2_9 b2_8 b2_7 b2_6 b2_5 b2_4 b2_3 b2_2 b2_1 b2_0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-1 r/w-0 r/w-1 r/w-0 r/w-1 r/w-0 r/w-1 r/w-0 r/w-0 r/w-1 r/w-1 legend: r/w = read/write; r = read only; -n = value after reset b2_15 to b2_0: b2 coefficient value. bits 15 to 0 twos complement format. range and resolution given in table 9 7.5.11.7 c2 coefficient register (address = 10h) [reset = 0000h] figure 46. c2 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 c2_11 c2_10 c2_9 c2_8 c2_7 c2_6 c2_5 c2_4 c2_3 c2_2 c2_1 c2_0 ? ? ? ? r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset c2_11 to c2_0: c2 coefficient value. bits 15 to 4 twos complement format. range and resolution given in table 9 7.5.11.8 tc0 coefficient register (address = 11h) [reset = 0034h] figure 47. tc0 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 tc0_ tc0_ tc0_ tc0_ tc0_ tc0_ tc0_9 tc0_8 tc0_7 tc0_6 tc0_5 tc0_4 tc0_3 tc0_2 tc0_1 tc0_0 15 14 13 12 11 10 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-1 r/w-1 r/w-0 r/w-1 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset tc0_15 to tc0_0: tc0 coefficient value. bits 15 to 0 twos complement format. range and resolution given in table 9 copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 33 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 7.5.11.9 tc1 coefficient register (address = 12h) [reset = 0000h] figure 48. tc1 coefficient register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 tc1_ tc1_ tc1_ tc1_ tc1_ tc1_ tc1_9 tc1_8 tc1_7 tc1_6 tc1_5 tc1_4 tc1_3 tc1_2 tc1_1 tc1_0 15 14 13 12 11 10 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset tc1_15 to tc1_0: tc1 coefficient value. bits 15 to 0 twos complement format. range and resolution given in table 9 7.5.12 manufacturer id register (address = 1eh) [reset = 5449h] figure 49. manufacturer id register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 id15 id14 id13 id12 id11 id10 id9 id8 id7 id6 id5 id4 id3 id2 id1 id0 r-0 r-1 r-0 r-1 r-0 r-1 r-0 r-0 r-0 r-1 r-0 r-0 r-1 r-0 r-0 r-1 legend: r/w = read/write; r = read only; -n = value after reset id15 to id0: manufacturer id bits. bits 15 to 0. reads 'ti' in ascii code. 7.5.13 device id register (address = 1fh) [reset = 0078h] figure 50. device id register 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 did11 did10 did9 did8 did7 did6 did5 did4 did3 did2 did1 did0 rid3 rid2 rid1 rid0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-0 r-1 r-1 r-1 r-1 r-0 r-0 r-0 legend: r/w = read/write; r = read only; -n = value after reset did11 to did0: device id bits. bits 15 to 4. reads 007h. rid3 to rid0: revision id bits. bits 3 to 0. reads 8h. 34 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 7.5.14 memory access register (address = 2ah) [reset = 0000h] the internal memory can be accessed through the memory access register. when the register is read, it returns the values in read name. when the register is written to, it must contain the value 6axxh to enable the contents of the register specified by adr4 to adr0 to be stored in memory. figure 51. memory access register: read 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 mem nwr_2 nwr_1 nwr_0 ? ? ? ? adr4 adr3 adr2 adr1 adr0 0 0 0 crpt r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 r/w-0 legend: r/w = read/write; r = read only; -n = value after reset figure 52. memory access register: write 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 gener mem single 0 1 1 0 1 0 1 0 adr4 adr3 adr2 adr1 adr0 al store load load n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a legend: n/a = reset value not applicable for write operation. nwr_2 to nwr_0: number of programs. bits 15 to 13. a memory location can be programmed a maximum of eight times. these bits contain the number of times this location has been programmed. after the eighth programming to a given location, subsequent attempts to program are ignored. mem crpt: memory corrupt. bit 12 (read only). this bit is a mirror of bit 8 in the status register. adr4 to adr0: memory address. bits 7 to 3. used to specify register address to operate on. address here is the same as the register in register address table.. general load: general load. bit 2 (write only). loads all registers from memory with the last value stored in memory for that register. adr[4:0] are don ? t care in this case. mem store: memory store. bit 1 (write only). write 1 to this bit along with the register address to store that registers contents to memory. single load: single load. bit 0. performs an load of the memory contents to the register address determined by the adr[4:0] bits. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 35 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the TMP007 is a complete ir thermopile sensor system on a chip that includes the sensing element, signal conditioner, adc, and math engine to calculate object and die temperatures. the TMP007 is ideal for applications where the object cannot be placed in thermal contact with a conventional temperature sensor. common reasons for noncontact temperature sensing are: ? distance; the object is too far away, or in an inconvenient location for wired connections. ? the object is in motion. ? direct contact of the object is inconvenient or uncomfortable (for example, skin). ? the object is a fluid (that is, liquid or gas). ? the object is hazardous (for example, acid or flammable). ? the object is in a hazardous state (for example, high voltage). 8.2 typical applications 8.2.1 wide-range calibration example: t obj = 0 c to 60 c, common versus unit calibration figure 53. typical application circuit 36 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 adr1 scl sda agnd v+ alert two-wire controller a3 b1 c2 b3 c3 a2 TMP007 2.5 v to 5.5 v 0.1 f adr0 c1 dgnd a1 10 k 10 k 10 k v+
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 typical applications (continued) 8.2.1.1 design requirements for this application, the system must operate over the environment described in table 10 . table 10. wide-range parameters design parameter example value comment n 32 number of devices in calibration set minimum t die 0 c minimum expected die temperature maximum t die 60 c maximum expected die temperature minimum t obj 0 c minimum expected objected temperature maximum t obj 60 c maximum expected object temperature 0.95 object emissivity field of view 110 field of view subtended by object conversion rate 1 sample/second select a set of values for t die and t obj to generate the calibration set. at a minimum, include the four extreme points of the temperature ranges desired. in practice, it is best to include a number of intermediate points as well. this example uses the values shown in table 11 , with an x marking the values chosen for measurement. table 11. wide-range measurement values t die t obj 0 c 20 c 40 c 60 c 0 c x x x x 20 c x x x x 40 c x x x x 60 c x x x x copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 37 product folder links: TMP007
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 8.2.1.2 detailed design procedure before attempting to calibrate the system, it is necessary to establish the stability of the system. noise is a measure of precision, which is the random deviation from the mean of the distribution. for a gaussian (or normal) distribution, the precision is typically characterized by the standard deviation (sensor noise), . 8.2.1.2.1 wide-range calibration to begin calibration, select an object temperature (t obj ) and a value for the die temperature (t die ). with these system temperatures stable, take a statistically significant number of samples of v sensor (results shown in register 00h). in this example, 64 samples were taken. do not use the object temperature readings given in register 03h; these values are invalid before calibration. to compensate for first order drift in system temperatures, it is often useful to normalize the data set. for this purpose, for each temperature set, the sensor voltage data (given in register 00h) is normalized by first finding the best fit line of the form shown in equation 11 : (11) the normalized data for each data set is then calculated as shown in equation 12 : (12) the normalized data, v sensor_norm , is centered on zero mean, and is first-order corrected for long-term drift. the standard deviation for each data set is then calculated to estimate the sensor noise, . verify that the data are limited by white noise and no other effects. for a sensor-noise-limited data set, v sensor is typically < 1 v, and preferably < 0.5 v after first-order correction for drift, as described previously. if this condition is not satisfied, then the calibration accuracy is limited by external system factors (for example, convection or conduction). repeat this process for each combination of t obj and t die for which the calibration is to be performed. the normalized data are used only for evaluating the suitability of the data set for calibration, and not for the actual calibration itself. for calibration, the mean value, < v sensor > , is calculated for each combination of t obj and t die , as shown in table 12 . using the mean value minimizes error introduced by random noise. based on the means, a set of coefficients is generated based on a user-selected optimization criteria for equation 7 . common criteria are minimizing the maximum error, minimizing the average error, and so on. for a detailed discussion of optimization methods, see sbou142 ? TMP007 calibration guide . table 12. mean values t die t obj 0 c 20 c 40 c 60 c 0 c < v sensor > < v sensor > < v sensor > < v sensor > 20 c < v sensor > < v sensor > < v sensor > < v sensor > 40 c < v sensor > < v sensor > < v sensor > < v sensor > 60 c < v sensor > < v sensor > < v sensor > < v sensor > 38 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 ( ) norm meas sensor (mv) sensor a sampleno b = - + sensor (mv) a sampleno b = +
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 8.2.1.2.2 verifying the calibration the next step is to use the generated coefficients to verify the calibration, and determine the accuracy of the system. for common calibration (c) , the same coefficients are used for all devices; in unit calibration (u) the coefficients are calculated for each device. common calibration includes device-to-device variation, and thus is less accurate, but much easier to implement. unit calibration is more accurate, and eliminates device variation, but requires more effort to implement. the choice depends on the application requirements for accuracy versus implementation effort. mean calibration error at each point is defined as shown in equation 13 : where ? t obj_predict is the temperature based on the calibration coefficients. ? t obj_actual is the known object temperature, measured independently. ? n is the number of devices in the calibration set. (13) the mean error graph (see figure 54 ) provides an efficient method of understanding how the systematic errors vary across the temperature ranges of interest. this graph also provides a means of weighing the benefits and efforts of common versus unit calibration for a particular application. note that calibration does not affect the temporal random noise observed, as shown in figure 55 . the standard deviation of the temperature error is independent of the calibration if the random error is dominated by the sensor noise and not external system factors, such as convection and conduction. for common calibration, the total standard deviation increases because of the effects of device-to-device variation. this standard deviation is calculated in the usual way, by substituting t obj_predict for the mean in the standard deviation formula. the accuracy is then defined as the mean calibration error plus the random errors from all sources. for this example application, use the criteria shown in equation 14 : (14) the resulting accuracy over t obj and t die is shown in figure 10 and figure 11 for the unit- and common- calibration approaches, respectively. clearly, the unit calibration results in higher accuracy, though common calibration is applicable for many application requirements. 8.2.1.3 application curves figure 54. mean calibration error, wide range over t die figure 55. noise in temperature measurement, wide range over t die copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 39 product folder links: TMP007 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 0 10 20 30 40 50 60 70 80 t obj mean error ( ? c) object temperature ( ? c) 0c-c 20c-c 40c-c 60c-c 0c-u 20c-u 40c-u 60c-u c015 0.00 0.05 0.10 0.15 0.20 0.25 0 10 20 30 40 50 60 70 80 t obj rms error 1 1 ( ? c) object temperature ( ? c) 0c-c 20c-c 40c-c 60c-c 0c-u 20c-u 40c-u 60c-u c016 accuracy mean calibration error 3 standard deviations = ( ) n mean obj_predict obj_actual 1 1 e t t n = - ?
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 8.2.2 narrow-range calibration example: t obj = 33 c to 41 c, unit vs common calibration figure 56. typical application circuit 8.2.2.1 design requirements for this application, the system must operate over the environment described in table 13 . table 13. narrow-range requirements design parameter example value comment n 16 number of devices in calibration set minimum t die 25 c minimum expected die temperature maximum t die 30 c maximum expected die temperature minimum t obj 33 c minimum expected objected temperature maximum t obj 41 c maximum expected object temperature 0.95 object emissivity field of view 110 field of view subtended by object conversion rate 1 sample/second select a set of values for t die and t obj to generate the calibration set. at a minimum, include the four extreme points of the temperature ranges desired. in practice, it is best to include a number of intermediate points as well. this example uses the values shown in table 14 , with an x marking the values chosen for measurement. in this application, the calibration set is weighted more densely around the region of interest. table 14. narrow-range measurement values t obj t die 33 c 34 c 35 c 36 c 36.5 c 37 c 37.5 c 38 c 38.5 c 39 c 40 c 41 c 25 c x x x x x x x x x x x x 30 c x x x x x x 8.2.2.2 detailed design procedure before attempting to calibrate the system, it is necessary to establish the stability of the system. noise is a measure of precision, which is the random deviation from the mean of the distribution. for a gaussian (or normal) distribution, the precision is typically characterized by the standard deviation (sensor noise), . 40 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 adr1 scl sda agnd v+ alert two-wire controller a3 b1 c2 b3 c3 a2 TMP007 2.5 v to 5.5 v 0.1 f adr0 c1 dgnd a1 10 k 10 k 10 k v+
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 8.2.2.2.1 narrow-range calibration to begin calibration, select an object temperature (t obj ) and a value for the die temperature (t die ). with these system temperatures stable, take a statistically significant number of samples of v sensor (results shown in register 00h). in this example, 64 samples were taken. do not use the object temperature readings given in register 03h; these values are invalid before calibration. to compensate for first order drift in system temperatures, it is often useful to normalize the data set. for this purpose, for each temperature set, the sensor voltage data (given in register 00h) is normalized by first finding the best fit line of the form shown in equation 15 : (15) the normalized data for each data set is then calculated as shown in equation 16 : (16) the normalized data, v sensor_norm , is centered on zero mean, and is first-order corrected for long-term drift. the standard deviation for each data set is then calculated to estimate the sensor noise, . verify that the data are limited by white noise and no other effects. for a sensor-noise-limited data set, v sensor is typically < 1 v, and preferably < 0.5 v after first-order correction for drift, as described previously. if this condition is not satisfied, then the calibration accuracy is limited by external system factors (for example, convection or conduction). repeat this process for each combination of t obj and t die for which the calibration is to be performed. the normalized data are used only for evaluating the suitability of the data set for calibration, and not for the actual calibration itself. for calibration, the mean value, < v sensor > , is calculated for each combination of t obj and t die , as shown in table 15 . using the mean value minimizes error introduced by random noise. based on the means, a set of coefficients is generated based on a user-selected optimization criteria for equation 7 . common criteria are minimizing the maximum error, minimizing the average error, and so on. for a detailed discussion of optimization methods, see sbou142 ? TMP007 calibration guide . table 15. mean values t obj t die ( c) 33 c 34 c 35 c 36 c 36.5 c 37 c 37.5 c 38 c 38.5 c 39 c 40 c 41 c 25 < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > 30 < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > < v sensor > 8.2.2.2.2 verifying the calibration the next step is to use the generated coefficients to verify the calibration, and determine the accuracy of the system. for common calibration (c) , the same coefficients are used for all devices; in unit calibration (u) the coefficients are calculated for each device. common calibration includes device-to-device variation, and thus is less accurate, but much easier to implement. unit calibration is more accurate, and eliminates device variation, but requires more effort to implement. the choice depends on the application requirements for accuracy versus implementation effort. mean calibration error at each point is defined as shown in equation 17 : where ? t obj_predict is the temperature based on the calibration coefficients. ? t obj_actual is the known object temperature, measured independently. ? n is the number of devices in the calibration set. (17) the mean error graph (see figure 54 ) provides an efficient method of understanding how the systematic errors vary across the temperature ranges of interest. this graph also provides a means of weighing the benefits and efforts of common versus unit calibration for a particular application. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 41 product folder links: TMP007 ( ) norm meas sensor (mv) sensor a sampleno b = - + sensor (mv) a sampleno b = + ( ) n mean obj_predict obj_actual 1 1 e t t n = - ?
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com note that calibration does not affect the temporal random noise observed, as shown in figure 55 . the standard deviation of the temperature error is independent of the calibration if the random error is dominated by the sensor noise and not external system factors, such as convection and conduction. for common calibration, the total standard deviation increases because of the effects of device-to-device variation. this standard deviation is calculated in the usual way, by substituting t obj_predict for the mean in the standard deviation formula. the accuracy is then defined as the mean calibration error plus the random errors from all sources. for this example application, use the criteria shown in equation 14 : (18) the resulting accuracy over t obj and t die is shown in figure 57 for the unit- and common-calibration approaches. clearly, the unit calibration results in higher accuracy, though common calibration is applicable for many application requirements. reduce the random temporal error by increasing the sample time. figure 58 shows the effects of increasing the sample time on the standard deviation. as a result of device-to-device variation, the effects of increased sample time on the common-calibration scheme is negligible; however, an improvement is seen for the unit calibration scheme. finally, the resulting accuracy is shown for the different sample times as a function of t die in figure 59 . improve the accuracy by generating separate coefficient sets for t die = 25 c and t die = 30 c. 8.2.2.3 application curves figure 57. mean error with unit and common calibration, figure 58. rms temperature error vs conversion rate narrow range over t die figure 59. accuracy vs conversion rate (unit calibration) 42 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 accuracy mean calibration error 3 standard deviations = -1.00 -0.75 -0.50 -0.25 0.00 0.25 0.50 0.75 1.00 30 32 34 36 38 40 42 44 46 t obj accuracy - unit calibration ( ? c) object temperature ( ? c) 25c-1 s 25c-4 s 30c-1 s 30c-4 s c017 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 30 32 34 36 38 40 42 44 46 t obj accuracy error ( ? c) object temperature ( ? c) 25c-u 25c-c 30c-u 30c-c c015 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 30 32 34 36 38 40 42 44 46 t obj rms error 1 1 ( ? c) object temperature ( ? c) c-1 s u-1 s u-4 s c016
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 8.3 system examples 8.3.1 use of nep, netd, and responsivity in estimating system performance it is often necessary to estimate system performance as part of the design process. a key system parameter is temperature accuracy for a given set of parameters. table 16 lists example parameters for estimating system performance. table 16. estimating system performance parameters design parameter example value comment object distance 10 mm distance to object object diameter 15 mm object size and geometry 0.95 object emissivity t die 23 c die temperature t obj 30 c maximum expected object temperature fov 110 field of view subtended by object responsivity (r 0 ) 10.8 v/w responsivity for t die = 25 c, = 0 responsivity (r) 9 v/w responsivity for 110 fov sensor rms noise 0.20 v rms sensor noise at t die = 25 c nep 30 nw thermal power equivalent to rms sensor noise conversion rate 1 sps sps = samples per second the system accuracy is a function of t obj , t die , , and radiation transfer. the radiation transfer factor is system dependent, and is affected by the object distance and geometry (for example, planar versus curved surfaces, or presence of lenses). for an planar object perpendicular to the detector axis (see figure 19 ), the radiation transfer follows the well-known sin 2 ( ) result. this expression can be used with a radiation transfer function responsivity value of 9 v/w to estimate system performance. because of the angular dependence of the TMP007 detector response, a more accurate representation for the same radiative transfer function geometry is shown in equation 19 : where ? r 0 is the responsivity of the detector to a point source at an angle normal to the detector ( = 0 in figure 19 . r 0 has a value of ~10.8 v/w at 25 c. (19) the responsivity value of 9 v/w is based on a system with a 110 fov. using the device-specific radiation transfer expression and r0, the detector response is shown in equation 20 : where ? obj is the emissivity of the object (0.95). ? is the stefan-boltzmann constant (5.67 10 -12 w/(cm 2 k 4 ). ? t obj is the object temperature (273 k + 30 c). ? t die is the detector temperature (273 k + 23 c). ? a det is the detector active area (1.09 10 -3 cm 2 ) ? is the half-angle subtended by the object as viewed from the detector. ? r 0 is the responsivity (~10.8 v/w for the specified temperatures). (20) copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 43 product folder links: TMP007 4 4 3 sensor obj obj die det 0 2 v = t t a (1 cos )r 3 h v t 3 0 2 1 cos r 3 t
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com the value of cos is shown in equation 21 : where ? r is the distance between the detector and the object (10 mm). ? d is the diameter of the object (15 mm). (21) differentiating with respect to object temperature, a small change in temperature creates a small change in the measured voltage given by equation 22 : (22) substituting values for the parameters yields equation 23 : (23) based on figure 4 , the sensor rms noise at t die = 25 c is ~0.25 v; thus, the rms variation in temperature measurement is as shown in equation 24 : (24) the peak-to-peak noise is approximately six times the rms noise; therefore, estimate an accuracy of approximately 0.33 c. this estimate can also be made using the noise-equivalent power (nep), noting that nep is the ratio of noise to responsivity, as shown in equation 25 : (25) assuming the system is sensor-noise limited, then from figure 5 , the nep is ~30 nw at 25 c, as shown in equation 26 : (26) again, the peak-to-peak noise is approximately 6x the rms noise; therefore estimate an accuracy of approximately 0.42 c. the different results from these two techniques is because of estimated values used for some parameters. the purpose of these techniques is not to obtain exact answers, but rather to quickly estimate the feasibility of a system implementation based on basic system parameters. these examples are intended only as guidelines; the specific values for the parameters depend on the specific system details. 9 power-supply recommendations the TMP007 is designed to operate with a power supply voltage (v s ) of between 2.5 v and 5.5 v. this input supply must be well regulated. the die temperature measurement (t die ) dependence on supply voltage is typically 20 m c/v for t die > 0 c (see figure 9 ). the power-on reset (por) has a nominal value of 1.9 v at t die = 25 c. the por increases with decreasing die temperature (see figure 12 ). place the decoupling capacitor (0.1 f recommended) as close as possible to the device without obstructing the field of view. as an aid to designing the power supply and estimating power and energy requirements, a number of typical curves are supplied. the typical characteristics for supply current vs t die (continuous conversion) are given in figure 15 . typical values for shutdown current as a function of t die and supply voltage are given in figure 14 . 44 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 obj 30 nw t 140 mk 213 nw/k ' | 3 3 out 8 obj b obj det obj obj 3 0 v nw nep t a 1 cos t 213 t r k h v t ' ' ' ? ? 1 . rms noise obj out sensor 0.25 9 t 110 mk v 2 3 9. ' | ' . sensor obj 9 v 2 3 t k ' u cos 3 3 8 out obj b obj det 0 obj 3 v t a 1 r t h v t ' ' . 2 2 2r cos 0 800 4r d t
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 10 layout 10.1 layout guidelines the ir thermopile sensor in the TMP007 is as susceptible to conducted and radiant ir energy from below the sensor on the pcb as it is to the ir energy from objects in its forward-looking field of view. when the area of pcb below the TMP007 is at the same temperature as the die or substrate of the TMP007, heat is not transferred between the ir sensor and the pcb. however, temperature changes on a closely-placed target object or other events that lead to changes in system temperature can cause the pcb temperature and the TMP007 temperature to drift apart from each other. this drift in temperatures can cause a heat transfer between the ir sensor and the pcb to occur. because of the small distance between the pcb and the bottom of the sensor, this heat energy will be conducted (as opposed to radiated) through the thin layer of air between the ir sensor and the pcb below it. this heat conduction causes offsets in the ir sensor voltage readings and ultimately leads to temperature calculation errors. to prevent and minimize these errors, the TMP007 layout must address critical factors: thermally isolate the TMP007 from the rest of the pcb and any heat sources on it. provide a stable thermal environment to reduce the noise in the measurement readings figure 60 illustrates the concept of thermally isolating the TMP007 from the pcb and external heat sources such as other components, air currents, and so on. figure 60. principle of TMP007 thermal isolation copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 45 product folder links: TMP007 field of view target object pcb copper groundempty fr-4 material TMP007 ir sensor k sensor_pcb k TMP007 electrically connected thermally isolated k board
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 10.2 layout examples for more detailed information, refer to sbou143 ? TMP007 layout and assembly guide . figure 61. layout example 46 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007 007 8x 6mil traces decoupling capacitor 8x vias 30mil diameter 15mil hole /alert
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 layout examples (continued) figure 62. enlarged view copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 47 product folder links: TMP007 copper fill 15mil15mil pad spacing 20mil b1 a1 a2 a3 b3 c3 c2 c1
TMP007 sbos685c ? april 2014 ? revised july 2015 www.ti.com 11 device and documentation support 11.1 device support 11.1.1 device nomenclature the device performance is characterized by the signal, responsivity, and the noise of the sensor. the sensor noise can be characterized in terms of the raw sensor voltage, or in terms of a reference system with known optical transfer function. responsivity a measure of the voltage generated by the thermopile as a function of the thermal radiation incident on the device. the responsivity is measured in v/w. typically incident radiations are in w and sensor output voltages in v. sensor noise the noise voltage intrinsic to the sensor given in nv. this parameter is conversion-time dependent. noise equivalent power (nep) the smallest thermal power difference that the detector can reliably detect; measured in nw. the nep is a function of the sensor noise and the responsivity. noise equivalent temperature difference (netd) the smallest temperature difference the detector can reliably detect; measured in millikelvins (mk). the netd is a function of the sensor noise, responsivity and the system specific optical path. for comparison purposes, netd is given for a reference system without a lens and with an ideal (nonabsorbing) f/1 lens. 11.2 documentation support 11.2.1 related documentation sbou142 ? TMP007 calibration guide . sbou143 ? TMP007 layout and assembly guide . 11.3 community resources the following links connect to ti community resources. linked contents are provided as is by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 11.4 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 11.5 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 48 submit documentation feedback copyright ? 2014 ? 2015, texas instruments incorporated product folder links: TMP007
TMP007 www.ti.com sbos685c ? april 2014 ? revised july 2015 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. copyright ? 2014 ? 2015, texas instruments incorporated submit documentation feedback 49 product folder links: TMP007
package option addendum www.ti.com 17-jan-2015 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples TMP007aiyzfr active dsbga yzf 8 3000 green (rohs & no sb/br) snagcu level-2-260c-1 year -40 to 125 TMP007 TMP007aiyzft active dsbga yzf 8 250 green (rohs & no sb/br) snagcu level-2-260c-1 year -40 to 125 TMP007 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 17-jan-2015 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TMP007aiyzfr dsbga yzf 8 3000 180.0 8.4 2.07 2.07 0.81 4.0 8.0 q1 TMP007aiyzft dsbga yzf 8 250 180.0 8.4 2.07 2.07 0.81 4.0 8.0 q1 package materials information www.ti.com 17-jan-2015 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TMP007aiyzfr dsbga yzf 8 3000 210.0 185.0 35.0 TMP007aiyzft dsbga yzf 8 250 210.0 185.0 35.0 package materials information www.ti.com 17-jan-2015 pack materials-page 2
d: max = e: max = 1.918 mm, min = 1.898 mm, min = 1.858 mm1.838 mm
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